Shenzhen Demingxin Semiconductor Co., Ltd announced the establishment of its IC packaging division on January 1, 2021, to further expand its presence in the integrated circuit (IC) market. The IC packaging division will focus on the research and development of high-quality and high-reliability IC packaging technology, and produce IC and LED dual spindles to provide comprehensive services for customers.

With the rapid development of China's technology industry, the integrated circuit industry is facing unprecedented opportunities. As a leading IC packaging service provider in China, Shenzhen Demingxin Semiconductor Co., Ltd will strengthen technological innovation and product development to meet the growing demands of its customers. We are committed to becoming a leader in the industry and providing comprehensive support and services for customers and the industry with the concept of "quality first, customer foremost".